LPC43S67-A70CM Cloud Connectivity Kit

The company NXP Semiconductors recently introduced a set of LPC43S67-A70CM Cloud Connectivity Kit, addressed to developers of devices connected to the Internet of things. It is alleged that a set can significantly reduce design time and accelerate time to market of new products.

LPC43S67-A70CM Cloud Connectivity Kit

NXP and Zentri presented a new set of devices for the creation of the Internet of things
Partner NXP’s creation was the company set Zentri, specializing in software development. The kit includes a board with a microcontroller NXP LPC43S67, security module and NTAG I2C NFC A7001CM, wireless module Murata SN8000 with support for Wi-Fi 802.11b / g / n, as well as the software platform Zentri Secure Connected Product Platform (ZentriOS, ZentriOS SDK, ZentriDMS and Zentri Mobile App SDK). The field of application set called vending machines, monitors physical activity and vital signs, interactive displays, industrial automation tools, diagnostic equipment, and household appliances.

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